A2 Global Electronics + Solutions announced the launch of its BGA reballing service. This service is now available at A2 Global’s facilities in the United States, the Netherlands, and Singapore, offering quick lead times and comprehensive component support for industries requiring high-reliability solutions.
A2 Global’s BGA reballing service offers solder ball conversions to support RoHS-compliant and RoHS-exempt applications and to recondition legacy components, supporting the needs of aerospace, defence, medical, transportation, and industrial industries.
A2 Global’s BGA reballing process ensures precision through micro solder ball mounting technology and customised thermal reflow profiles. Automated optical inspection confirms proper alignment and reflow, minimises thermal stress, preserves solder ball integrity, and reduces the risk of damage to guarantee quality and reliability.
Customers can either procure components directly from A2 Global or send their own components to be reballed. With integrated reballing and testing capabilities, A2 Global minimises handling and optimises efficiency, ensuring precision and reliability throughout the entire process.
“Our BGA reballing service provides a cost-effective solution to modify or restore components while maintaining the highest quality and reliability,” said Anthony Andriano, Chief Financial Officer and EVP of Operations and Value-Added Services at A2 Global Electronics. “With this offering available at our global facilities, we’re well-positioned to meet the evolving needs of the electronic component industry.”
A2 Global prides itself on its quick turnaround times, helping customers reduce lead times and maintain efficient production schedules. With strategically located facilities in North America, Europe, and Asia, A2 Global serves clients across the globe, ensuring reballing services wherever needed.
