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Intel claims $7.86bn CHIPS Act funding

Intel claims $7.86bn CHIPS Act funding

The US Department of Commerce and Intel have reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the US CHIPS and Science Act.

The award will support Intel’s previously announced plans to advance critical semiconductor manufacturing and advanced packaging projects at its sites in Arizona, New Mexico, Ohio and Oregon. Intel also plans to claim the US Treasury Department’s Investment Tax Credit, which is expected to be up to 25% of qualified investments of more than $100 billion.

“With Intel 3 already in high-volume production and Intel 18A set to follow next year, leading-edge semiconductors are once again being made on American soil,” said Pat Gelsinger, CEO of Intel. “Strong bipartisan support for restoring American technology and manufacturing leadership is driving historic investments that are critical to the country’s long-term economic growth and national security. Intel is deeply committed to advancing these shared priorities as we further expand our US operations over the next several years.”


The announcement demonstrates the US government’s confidence in Intel’s essential role in building a resilient, trusted semiconductor supply chain on domestic soil. Since the passage of the CHIPS and Science Act more than two years ago, Intel has announced plans to invest more than $100 billion in the US to expand chipmaking and advanced packaging capacity and capabilities critical to economic and national security. The historic investments will support tens of thousands of jobs, strengthen US supply chains, foster US-based R&D, and help ensure American leadership in cutting-edge semiconductor manufacturing and technology capabilities.

“The CHIPS for America programme will supercharge American technology and innovation and make our country more secure – and Intel is expected to play an important role in the revitalisation of the US semiconductor industry,” said US Secretary of Commerce Gina Raimondo. “Thanks to the leadership of President Biden and Vice President Harris, our CHIPS award is catalysing Intel to make one of the largest investments in semiconductor manufacturing in US history.”

The award follows the previously signed preliminary memorandum of terms and the completion of Commerce’s due diligence, in addition to the announced investment tax credit. The final total award is less than the proposed preliminary award due to a congressional requirement to use CHIPS funding to pay for the $3 billion Secure Enclave programme.

Managing Editor
Paige Hookway is the Managing Editor of Procurement Pro, where she brings over a decade of industry experience to shaping insightful, engaging, and forward-thinking content for the global electronics community. After graduating from the University of Greenwich with a 2:1 in English Literature, Paige blended her love of storytelling with a deep curiosity for technology – carving out a career that champions both innovation and the people behind it. Across her 10+ years in the sector, Paige has developed a strong reputation for uncovering emerging trends, translating complex concepts into accessible insights, and spotlighting the voices shaping the future of engineering. She is particularly passionate about encouraging the next generation of engineers and elevating women in tech narratives that inspire, empower, and drive meaningful change. When she’s not immersed in the latest engineering developments, Paige can be found wrapped up in a blanket with a cup of tea and a good book.