STMicroelectronics

STMicroelectronics announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026. PLP is an advanced, automated chip packaging and test process technology bringing increased manufacturing efficiency and reducing costs, and a key

STMicroelectronics has extended the ongoing longevity programme for its widely deployed SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years, ensuring availability of general-purpose and high-performance product lines until at least 2038. Among the general-purpose lines, the SPC58 H series that contains up to 10MB non-volatile memory (NVM) for code and data storage will