Teledyne e2v Semiconductors, a Teledyne Technologies Inc. company, and Viking Technology, a division of Sanmina Corporation, announce a strategic distribution agreement.
This collaboration brings together two industry leaders to deliver advanced memory and storage solutions to customers across the EMEA (Europe, the Middle East & Africa) and APAC (Asia-Pacific) regions, with a focus on aerospace & defence applications.
Under this agreement, Teledyne e2v will distribute Viking Technology’s high-performance DRAM and Flash storage products, starting with the Parallel Cell family of multi-chip package (MCP) DDR4 memory solutions. These MCPs offer performance and density per cubic inch compared to conventional memory DIMMs and are available in 4, 8, and 16GB capacities. Designed for mission-critical environments, they are military qualified and defence avionics ready.
“Collaborating with Viking Technology allows us to expand our portfolio with cutting-edge memory and storage solutions that align closely with Teledyne e2v’s offerings for aerospace and defence platforms,” said Thomas Guillemain, Business Development Manager at Teledyne e2v Semiconductors. “This strategic alliance strengthens our ability to support customers with integrated, high-reliability solutions.”
“We are excited to partner with Teledyne e2v to extend the reach of our ruggedised memory solutions,” said Hamid Shokrgozar, President Viking Technology. “This agreement builds on more than eight years of successful collaboration between our teams. Their deep expertise in aerospace and defence markets, combined with our advanced technology, creates a powerful synergy that will benefit customers developing next-generation systems.”
This collaboration underscores both companies’ commitment to delivering innovative, high-reliability solutions to the most demanding environments.
