DigiKey spotlights new products at embedded world
DigiKey will showcase innovative, new embedded system products at its booth, 4A-633, during embedded world 2025. The company will also feature leading suppliers,
Events
News
Arm to bolster Malaysia’s semiconductor industry
In a landmark move to bolster its semiconductor sector, Malaysia has entered into a strategic partnership with Arm, aiming to position the nation
Industry Insights
British semiconductor, AI technologies in high demand
The innovative semiconductor and artificial intelligence (AI) technologies showcased by six UK companies on a trade mission to South Korea in February have
Market Analysis
Drip by drip: semiconductor water management innovations
Not only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest
Events
Visit PCBWay at embedded world 2025
PCBWay has announced its participation in embedded world 2025, from 11th – 13th March, in Munich, Germany. Booth No: 3A-532 Time: 2025.03.11-2025.03.13 Location:
News
Trump announces $100Bn for five new TSMC factories
President Donald Trump and TSMC CEO C.C. Wei announced a significant expansion of TSMC’s operations in Arizona, United States. The company committed to
Sustainability
Webinar: common pitfalls navigating ESG regulations
Join one of Z2Data’s Compliance Advisors, Kelsey Brown, on 12th March for a deep dive into common ESG compliance mistakes and how to
Events
Avnet Silica to showcase Edge AI Phone Box
Avnet Silica, an Avnet company, will feature demonstrations of Generative AI at the Edge, including its iconic Phone Box demo, alongside innovations in
Quality Assurance
The value of customisation: beyond the standard
In an era where mass production and standardisation dominate the global marketplace, the allure of custom products remains undiminished, symbolising not only personal
News
Analog Devices wins $105M in Federal CHIPS funding
Analog Devices, Inc. (ADI), headquartered in Wilmington, has signed a preliminary memorandum of terms with the federal government through the CHIPS Program Office.