News

Teledyne e2v HiRel Electronics, a provider of high-reliability semiconductor solutions, announced a new partnership with Flip Electronics. Under the new agreement, Flip Electronics will maintain substantial inventories of Teledyne e2v HiRel’s semiconductor wafers for military applications, ensuring a consistent and reliable supply of critical components. “Our semiconductor longevity programmes provide a significant competitive advantage to

Mouser Electronics has partnered with Analog Devices (ADI) to offer the engineering community a new webinar called ‘Optimising Robotics with Radar and Sensor Fusion Technologies’. The free webinar will take place on 29th October 2024 at 17:00 CET. With the increasing use of robotics across various industries, solutions for precise perception and movement have become

Smith announces its certification to the ISO 13485 standard at its Amsterdam distribution centre. Smith’s operational headquarters in Houston, Texas, previously received accreditation in December 2017. The ISO 13485 certification defines standards for organisations that provide medical devices and related products or services. Obtaining this certification further demonstrates Smith’s ability to properly source, inspect, test,

Mouser Electronics continues its partnership with Bel, a provider of solutions that power, protect, and connect electronic circuits. Since 2014, Mouser has offered a growing selection of Bel’s latest products, which includes offerings from Bel Fuse, Bel Magnetic Solutions, Bel Power Solutions, CUI Inc, Cinch Connectivity Solutions, Signal Transformer, and more. Mouser currently offers over

Adam Fletcher, Chairman of the Electronic Components Supply Network (ecsn), has announced the appointment of Simon Meadmore to the association’s Leadership Group steering committee. Meadmore, representing long-standing ecsn member RS Components, brings over 30 years of experience in the electronic components industry. His wealth of knowledge will be an asset to the Leadership Group and,

Farnell has expanded its range of test and measurement equipment with the introduction of the Keysight Technologies InfiniiVision HD3 Series oscilloscope. This new addition is designed to help engineers detect even the most subtle and sporadic signal anomalies, enabling them to quickly identify and resolve issues across a variety of applications. The Keysight HD3 Series

TTI IP&E – Europe has received two awards from TE Connectivity: ‘Global Broadline Distributor of the Year’ and ‘EMEA Broadline Distributor of the Year’. These accolades highlight TTI IP&E – Europe’s exceptional performance in supporting joint customers and driving new business development, positioning it at the forefront of TE Connectivity’s platinum distribution group. Sean Miller,

EnSilica has joined the Design Centre Alliance (DCA) of the Taiwan Semiconductor Manufacturing Company‘s (TSMC) Open Innovation Platform (OIP). This partnership signals a strategic move for EnSilica, reinforcing its role in advancing the development of next-generation system-on-chip (SoC) designs. The TSMC DCA programme is designed to support chip implementation services and system-level design solutions, helping