News

Foxconn commits €250M to Europe’s first fan-out WLP facility

Foxconn commits €250M to Europe’s first fan-out WLP facility

Foxconn has announced a strategic partnership with Thales Group of France in the fields of semiconductors and space, a move that deepens the industrial expertise and broadens the European footprint of one of the world’s largest electronics manufacturing service providers.

Announced at Choose France, an economic summit convened by French President Emmanuel Macron, the first of two MOUs for Foxconn could aggregate additional European industrial investors to sustain an investment in excess of €250 million while ensuring a strong European leadership in an outsourced semiconductor assembly and test (OSAT) facility.

Foxconn is exploring the potential in preliminary discussions with government-backed Thales and Radiall, a French connector and component maker. If successfully concluded, the facility would address the European aerospace, automotive, space telecoms, and defence advanced packaging markets, while bringing together other European industrial investors.


The OSAT project would use fan-out wafer level packaging (FOWLP), which would make such a facility a first in the second-largest economy of the European Union. With this development, Foxconn deepens its industrial expertise and global footprint, strengthening the resilience of the supply chain and making key investments in new businesses.

The second MOU covers the domain of satellite constellations. Combining Foxconn’s advanced manufacturing and space technologies of Thales Alenia Space, a Joint Venture between Thales (67%) and Leonardo (33%), this initiative aims at exploring the value of developing together high quality/high-value series satellite production in order to provide superior technological content to customers for their large telecommunications satellite constellation projects in Low Earth Orbit.

Foxconn is an emerging stakeholder in the space ecosystem, launching its own low earth orbit CubeSat in 2023 as proof-of-concept, expanding its next-generation beyond 5G (B5G) capabilities and entering satellite constellation manufacturing with the aim to industrialise the LEO sector with its half-century of ICT experience.

Managing Editor
Paige Hookway is the Managing Editor of Procurement Pro, where she brings over a decade of industry experience to shaping insightful, engaging, and forward-thinking content for the global electronics community. After graduating from the University of Greenwich with a 2:1 in English Literature, Paige blended her love of storytelling with a deep curiosity for technology – carving out a career that champions both innovation and the people behind it. Across her 10+ years in the sector, Paige has developed a strong reputation for uncovering emerging trends, translating complex concepts into accessible insights, and spotlighting the voices shaping the future of engineering. She is particularly passionate about encouraging the next generation of engineers and elevating women in tech narratives that inspire, empower, and drive meaningful change. When she’s not immersed in the latest engineering developments, Paige can be found wrapped up in a blanket with a cup of tea and a good book.