Yole Group

Market Analysis

Compound semiconductors enter new growth phrase

Yole Group announces the release of its annual market and technology report, Status of the Compound Semiconductor Industry 2026 – Focus on Substrates and Epiwafers, highlighting sustained structural growth through 2031. Despite short-term pricing pressure in certain segments, electrification, AI infrastructure expansion, and next-generation connectivity are reinforcing long-term demand for compound semiconductor materials, including SiC,

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Market Analysis

RF GaN: geopolitics fuel sustained growth

According to Yole Group’s latest report on the RF GaN market, GaN devices play a critical role in high-power RF signal generation and amplification, with growing adoption across telecom infrastructure, defence, and satellite communications. The market is expected to reach $2.4 billion by 2031, growing at a 11% CAGR between 2025 and 2031, up from

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Market Analysis

Power SiC faces overcapacity downturn

The power SiC market continues its transformation. Following an unprecedented investment wave between 2019 and 2024, the industry is now entering a correction cycle. Yole Group’s latest report, Power SiC 2025 – Front-End Manufacturing Equipment, delivers an in-depth analysis of this shift, covering market metrics, technology trends, and competitive dynamics shaping SiC equipment across boule

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Industry Insights

Could glass be a critical enabler for semiconductor manufacturing?

Yole Group announces the release of its new technology & market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analysing the rapid rise of glass as a strategic material in semiconductor processes and permanent device architectures. Through a consolidated analysis of multiple end markets, including CIS, MEMS, RF, power devices, memory/HBM, AR/VR, and

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Market Analysis

IGBT market heading toward $13Bn by 2030

Yole Group announces the release of two new complementary analyses: IGBT 2025, a market & technology trends report, and Si IGBT Comparison 2025, providing the industry’s most comprehensive analysis of silicon IGBT devices, markets, designs, and competitive landscapes. Together, Yole Group’s reports deliver insights into the future of IGBTs at a time when SiC and

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Market Analysis

Semiconductor industry 2025: worldwide dynamics

Yole Group announces the release of two complementary reports: Overview of the Semiconductor Devices Industry – H2 2025, providing a global assessment of the semiconductor devices market, and China Semiconductor Industry 2025, offering an in-depth analysis of China’s emerging semiconductor supply chain from equipment to devices, including foundries and OSATs. Together, these two new publications

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Market Analysis

piezoMEMS: a market poised to outpace MEMS

Beyond RF MEMS, piezoMEMS is emerging as one of the most dynamic segments in the MEMS industry. This technology is particularly impactful in consumer electronics, where it powers microspeakers, microphones, MEMS autofocus, and several new sensors and actuators currently in development. While the market slowed in the past two years due to global economic headwinds,

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Market Analysis

Greater China MEMS industry on the rise

The MEMS industry in Greater China continues to show solid growth, supported by a diverse range of applications and a maturing ecosystem, announces Yole Group’s analysts. According to Yole Group’s latest report, Greater China MEMS Industry 2025, MEMS revenues from Greater China reached $1.7 billion in 2024, representing 8.4% year-on-year growth and accounting for 10%

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Market Analysis

Power GaN market set for rapid sixfold expansion

Yole Group announces the release of its new edition of the Power GaN report, Power GaN 2025. This provides an in-depth analysis of the global power GaN market trajectory, covering market values and volumes, supply chain dynamics, and technology innovations from 2020 to 2030. The report’s objective is to deliver a comprehensive understanding of GaN’s

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Market Analysis

New growth engines for glass in advanced packaging

As semiconductor chip architectures become more complex and performance-driven, the materials enabling advanced packaging are evolving just as fast. Yole Group’s new report, Glass Materials for Advanced Packaging 2025, provides the first in-depth analysis dedicated to the fast-growing glass materials market across multiple packaging platforms, including glass core substrates, glass interposers, glass carriers, TGVs, and

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