Tata Electronics has signed a Memorandum of Understanding (MOU) with ASMPT to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
Through this partnership, ASMPT and Tata Electronics will collaborate for workforce training, advancing service engineering infrastructure, automation, spare supports and boosting R&D initiatives in the area of wire bond, flip chip, advanced packaging and integrated system packaging. This partnership shall also focus on energy and material efficiency to promote sustainable growth and strengthen the semiconductor supply chain ecosystem.
Dr. Randhir Thakur, Managing Director & CEO, Tata Electronics, said: “We have a bold vision to establish India as a leading electronics manufacturing hub by offering integrated solutions across the electronics manufacturing value chain to global customers seeking a resilient supply chain. This partnership will emphasise the development of essential training programs and advanced research and development, while also nurturing a vibrant ecosystem within the country.”
Robin Ng, Group CEO, ASMPT added: “We are excited to partner with Tata Electronics to realise their vision of establishing a global electronics supply chain in India. By leveraging our collective expertise and resources, we are well-positioned to drive significant progress in the semiconductor industry. This collaboration will not only propel technological innovation but also cultivate the talent required for sustained future growth.”
Recently, India Prime Minister Narendra Modi laid the foundation stones for two Tata Electronics facilities, including a state-of-the-art semiconductor fab in Dholera, Gujarat, and a Semiconductor Assembly and Test (OSAT) Facility in Jagiroad, Assam.
ASMPT’s continuous investment in R&D will help to provide the cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
