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TTI IP&E awarded Global Broadline Distributor of the Year

TTI IP&E has been honoured with the ‘Global Broadline Distributor of the Year’ by TE Connectivity for its 2025 results. This prestigious award recognises outstanding performance across all regions, with TTI Europe contributing strongly to this global success. The award recognises TTI’s excellence across key criteria, including sales performance, available-to-sell inventory strength, demand creation, operational

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Mouser, EPC ink global pact

Mouser Electronics and Efficient Power Conversion (EPC) have sealed a global distribution agreement. “This global agreement with Mouser is part of our distribution strategy to engage with more engineers who are looking at designing with GaN because of the benefits it offers over silicon,” said Nick Cataldo, Senior VP Sales & Marketing of EPC. “Mouser

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Smith announces 10 millionth image scanned by Argus

Smith has captured more than 10 million images via Argus, the company’s proprietary visual-inspection solution. Launched in May 2025, Argus captures and stores high-resolution images of the surface of every component within a reel. It then uses its internally developed AI software to analyse the images, identify abnormalities, and flag parts for further evaluation in

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Orbweaver, Budde Marketing to unify supply chain data

Orbweaver, LLC has agreed to acquire Budde Marketing Systems, Inc., combining two specialists in electronics industry data to form what the companies describe as a comprehensive intelligence and orchestration platform built specifically for electronic component manufacturers and distributors. Orbweaver, founded in 2012, operates an enterprise-grade platform that connects trading partners, synchronises product data, and automates

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Siemens democratises EDA software access

Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe’s semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project. This collaboration grants companies accepted into the

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Anglia signs pan-European deal with Same Sky

Anglia Components has signed a pan-European authorised distribution agreement with Same Sky, the manufacturer of a range of product technologies, including audio, interconnect, motion and control, relay, sensor, switch, and thermal management solutions. Same Sky was formerly known as CUI Devices. Commented David Pearson, Anglia’s Technical Director: “This partnership significantly enhances our audio portfolio and

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Molex completes acquisition of Teramount Ltd.

Molex, a global electronics specialist and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel based developer of detachable fibre to chip connectivity solutions optimised for high volume Co Packaged Optics (CPO) and other silicon photonics applications. “Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor grade wafer level processes –

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Renesas completes acquisition of Irida Labs

Renesas Electronics announced that a subsidiary of the company has completed the acquisition of Irida Labs, a Greece-based company specialising in embedded software for AI-powered visual perception systems. The acquisition strengthens Renesas’ Edge AI embedded processing offerings, a key secular growth area for Renesas. It also enables system-level solutions that integrate physical AI and software

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Samsung joins the trillion-dollar club

Samsung Electronics has crossed the $1 trillion market capitalisation threshold – a milestone that places it alongside a handful of the world’s most valuable technology companies, and only the second Asian company after TSMC to reach that height. The reason? An AI-driven memory supercycle that is reshaping the economics of the semiconductor industry. Shares surged

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DigiKey, Morse Micro seal distribution pact

Morse Micro, a Wi-Fi HaLow silicon provider, has signed a distribution agreement with DigiKey. The partnership expands global access to Morse Micro’s award-winning Wi-Fi HaLow products, making it easier for engineers, developers, and solution providers to evaluate, prototype, and build next-generation long-range, low-power wireless devices. Through DigiKey’s global distribution platform, customers can now access a

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