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Microchip Technology’s Armenian office has received approval from the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) for an export license authorising the use of advanced technology under Export Control Classification Number (ECCN) 3E001 and related high-performance hardware under ECCN 3A001.a.7.b. Such authorisation requires companies to demonstrate rigorous compliance with US export regulations, including
Polar Semiconductor and Nexperia have announced a strategic collaboration to manufacture next generation power MOSFET devices at Polar Semiconductor’s US based wafer foundry. The partnership supports an expanded power MOSFET portfolio while strengthening supply for customers worldwide. By combining Polar’s expertise in power semiconductor manufacturing and ongoing capacity expansion with Nexperia’s power MOSFET technology, the
GlobalFoundries announced the completion of its acquisition of Synopsys’ ARC Processor IP Solutions business. Combined with MIPS, by GF, the acquisition establishes GF as a technology partner offering customers a software-to-silicon capability purpose built for Physical AI. MIPS combined with ARC brings together RISC-V processor IP, software tools, custom design, and advanced manufacturing into a
TTI IP&E – Europe marks 25 years of its operations and a journey of successive growth in Sweden, at a time when both the electronics industry and the role of distribution have shifted significantly. TTI established its Swedish presence in 2001, opening an office in Stockholm, then quickly expanding to Gothenburg as customers and their
Anglia Components has signed a pan-European distribution agreement with Nanopower Semiconductor, the Norwegian company pioneering IoT system power reduction and battery elimination. Introduced last year, Nanopower’s nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. By taking over the role of monitoring sensors and managing wake-up logic, nPZero
TSMC debuted its latest innovation in its most advanced process technology at the company’s 2026 North America Technology Symposium. TSMC’s new A13 process is a direct shrink of its A14 node announced in 2025, enabling even more compact and efficient designs to address insatiable customer demand in computational requirements for next-generation artificial intelligence, high-performance computing
TSMC is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing. As chips move to more advanced nodes, bringing them from design to high-volume production has become one of the world’s most complex computing challenges. Computational lithography, transistor simulation, process control, and wafer inspection now require massive-scale simulation and real-time optimisation, and
DigiKey has received 29 awards from its supplier partners during the 2026 EDS Leadership Summit, held 18-22nd May 2026, in Las Vegas. “DigiKey is honoured to receive these prestigious industry recognitions from our valued supplier partners,” said Mike Slater, Vice President of Global Business Development for DigiKey. “The awards acknowledge how much our partners value
The Global Electronics Association announced the formation of the Global Electronics Policy Council (GEPC), a new body uniting leading electronics companies from around the world to advance a coordinated policy agenda across every major region of the electronics supply chain. The GEPC builds on the Association’s longstanding electronics industry advocacy work over its nearly 70-year
Silanna Semiconductor has pledged to freeze prices of its analog to digital converters (ADCs) for two years on receipt of volume production orders from customers. The aggressive move sees Silanna take on the behemoths of the ADC market whose prices have risen in the past few months. Silanna’s Global Vice President of Sales and Operations