WIN Semiconductors welcomes SawStreet to partner program
WIN Semiconductors has announced the addition of Orlando, Florida-based SawStreet LLC to the WIN Alliance Partner Program. The partnership complements WIN’s in-house backend processes, giving customers another trusted partner for wafer grinding and thinning, dicing, pick-and-place, and die inspection. SawStreet handles thicknesses as low as 50µm, and specialises in wafer grinding and thinning, including dice-before-grind

