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Texas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground. Leaders from TI were joined by local and state elected officials to celebrate the opening of this state-of-the-art 300mm semiconductor fab in North Texas. The new facility, called SM1, will
Mouser Electronics announces a global distribution agreement with Telit Cinterion, an end-to-end IoT solutions enabler, for their industrial-grade cellular, wireless communication, and positioning modules for IoT and IIoT solutions. “Mouser is pleased to add Telit Cinterion to our global line card,” said Kristin Schuetter, Mouser Senior Vice President of Products. “Their innovative, high-performance IoT portfolio
For the fifth consecutive year, Avnet will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to market dynamics since 2021. This year’s survey provides new insight into how engineers are embracing artificial intelligence (AI), and the continued promise and challenges this latest technological evolution presents for product
Accu has been named International Company of the Year (£10 million–£30 million) at Insider’s Northern International Trade Awards, which celebrates the successes of the North West, North East and Yorkshire’s top exporters, importers, and their supply chains. The award recognises Accu’s achievements in delivering an unrivalled service for the supply of quality components to over
Panasonic Industry Europe is pleased to announce that it has been named Best Supplier of the Year for Passive Components by Syndicat Professionnel de la Distribution en Electronique Industrielle (SPDEI). The SPDEI Award is a prestigious French industry award recognising top suppliers of electronic components, voted on by distributors for excellence in partnership, product innovation,
Tape and reel is a packaging and handling method used for electronic components, primarily surface-mount devices (SMDs), that prepares them for automated assembly. In this process, individual components are placed in shaped pockets on a continuous strip of carrier tape. A protective cover tape is sealed over the pockets, and the tape is wound onto
Siemens and GlobalFoundries (GF) have entered a new strategic collaboration to leverage each company’s complementary AI-based capabilities to enhance performance of semiconductor manufacturing and advanced industries – making operations more efficient, secure, and reliable. In their latest memorandum of understanding, the companies focus on automation technologies for semiconductor fabrication (fab automation), electrification, digital solutions, and
CHIPX, a next-generation semiconductor and photonics manufacturer, announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind in the ASEAN region. The facility will introduce advanced GaN/SiC manufacturing, driving Malaysia’s entry into front-end semiconductor production and accelerating domestic capability in photonics, high-bandwidth optical interconnects, and advanced materials engineering
On 10th December 2025, the General Assembly of the European Semiconductor Industry Association (ESIA) gathered in Brussels, Belgium, to elect Michael Budde, President Mobility Electronics at Bosch, as the organisation’s new President for the next two years. ESIA represents and promotes the common interests of the Europe-based semiconductor industry towards the European institutions and stakeholders.
Rutronik and ROHM Semiconductor celebrate 30 years of successful collaboration – marking a milestone in their enduring partnership that has significantly shaped the European electronics distribution landscape. Founded in 1973 and owner-managed in Ispringen, in the South of Germany, Rutronik has grown to become one of Europe’s leading distributors of electronic components. With a strong