Our aim is to offer guidance on the ever-changing decision-making processes in the electronics sector and become the "go-to" guide for industry professionals looking to source top components.
Mouser Electronics has released a new eBook focusing on motor control. Electric motors are a critical component in a wide array of applications, from vehicles and household appliances to industrial equipment and HVAC systems. As industries strive for greater sustainability, the challenge lies in maximising motor efficiency while managing costs effectively. Titled Mastering Motor Control
Mouser Electronics has launched a new edition of its Empowering Innovation Together (EIT) technology series. This latest instalment explores the integration of renewable energy into smart grid technology, with a focus on the critical role AI and 5G play in ensuring sustainable grid management. Smart grid systems offer more precise monitoring of power usage and
Farnell has announced its new role as an official global distributor for Silvertel, a designer of power-over-ethernet (PoE) modules, telecoms solutions, DC-DC converters, and battery charge modules. This partnership will enable Farnell to expand Silvertel’s reach and provide access to its innovative products to customers worldwide. Founded in 1997, Silvertel has been at the forefront
In recent years, the U.S., Japan, and the Netherlands have progressively tightened restrictions on China’s access to semiconductor technology. In contrast, South Korea has responded more cautiously to U.S. demands, owing to its heavy reliance on the Chinese market. This is all in the midst of growing U.S.-China tensions. However, according to a report by
Market Dojo, a provider of on-demand eProcurement software, announces its inclusion in ‘AI-Powered Sourcing Automation – Market Overview and Provider Landscape’ report by Everest Group. This recognition underscores Market Dojo’s commitment to delivering innovative and customer-centric sourcing solutions that meet the evolving needs of procurement professionals worldwide. The Everest Group report, which provides a comprehensive
Astute Group is now an official distributor for Good-Ark Semiconductor across EMEA and beyond. The Stevenage, UK-based distributor will offer a comprehensive range of discrete semiconductor products, including diodes, rectifiers, bridge rectifiers, protection devices (TVS, chip fuses, and thermistors), thyristors (SCRs and triacs), transistors, small signal MOSFETs, power MOSFETs, and MEMS (accelerometers). Good-Ark Semiconductor, a
Distributor Lane Electronics has appointed Phil McDavitt to the new role of Strategic Business Manager RF and Fibre-Optic connector products. Industry veteran McDavitt brings a wealth of technical and commercial knowledge across a number of high-quality, high-performance RF and Fibre-Optic product groups gained through previous employment with leading manufacturers such as TE, Radiall and Transradio.
Everspin Technologies, Inc., the developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) solutions, has received a strategic award to develop a comprehensive plan for providing manufacturing services tailored to the aerospace and defence sectors. This initiative focuses on ensuring a secure and reliable MRAM manufacturing supply chain. Sanjeev Aggarwal, President and CEO of Everspin
Adhesives, coatings, and sealants supplier Intertronics has announced a new distribution agreement with medmix, a system provider in mixing, dosing, and adhesives application for industrial applications, for its MIXPAC product range. Intertronics can immediately supply a range of mixers, cartridges, and dispensers to its UK customers that will serve multiple sectors, from electronics to construction.
Tata Electronics has signed a Memorandum of Understanding (MOU) with ASMPT to collaborate on establishing semiconductor assembly equipment infrastructure and solutions. Through this partnership, ASMPT and Tata Electronics will collaborate for workforce training, advancing service engineering infrastructure, automation, spare supports and boosting R&D initiatives in the area of wire bond, flip chip, advanced packaging and