News

Farnell has announced the appointment of two sales leaders to drive growth and strengthen customer engagement across the EMEA and Americas regions. Daniel Ford joins Farnell as Vice President of its EMEA sales organisation. With over 21 years of experience at Future Electronics, Daniel is highly regarded for his contributions to sales growth in the

The Biden-Harris Administration announced that the US Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide $285 million to establish and operate a Manufacturing USA Institute. With combined funding totalling $1 billion, this investment will support the launch of the first-of-its-kind CHIPS Manufacturing USA

Mouser Electronics introduced a comprehensive RISC-V resource centre, empowering design engineers with knowledge on the latest technology and applications. As the open-source architecture gains popularity, RISC-V stands out as a new way to develop the cutting-edge hardware and software of the future. From smartphones and IoT devices to high-performance computing, RISC-V is growing across a

TTI IP&E – Europe announces the extension of its franchise agreement with Sensata Technologies with the addition of its Electrification product lines of Sensata & Gigavac including relays, contactors, and fuses. Experts from TTI and the Sensata/Gigavac team can offer advice and support to help select the mission-critical components designed to power the next generations

Infineon has reported Q4 revenues of €3.92 billion up 6% from the previous quarter. The company says that all four quarters – automotive, green industrial power and sensor systems and connected secure systems contributed to the increase. Infineon has managed the 2024 fiscal year well and concluded it in line with expectations,” said Jochen Hanebeck

EnSilica recently announced it has become an Open Innovation Platform (OIP) partner for TSMC. EnSilica’s value is in enabling the next-generation of system-on-chips (SoCs), ranging from mixed signal devices for industrial and automotive applications to communications and Edge artificial intelligence (AI) chips using TSMC’s most advanced process technologies. The company has also now surpassed the

ECIA has announced the recipients of the 2024 Distinguished Service Awards. Each year the ECIA Board honours exceptional individuals who have made significant contributions to ECIA and the industry. The following six individuals have received unanimous and enthusiastic approval from ECIA’s Board of Directors for the 2024 ECIA Distinguished Service Award: Alan Ahern: Alan served

ECIA has announced Phil Gallagher as this year’s recipient of its highest annual honour, the North Star Award. “This prestigious accolade celebrates individuals whose unwavering commitment, exceptional leadership, and tireless dedication have significantly impacted the field of electronic components and the ECIA community,” ECIA President and CEO David Loftus explained during the award ceremony at

Farnell has announced a new partnership with Flexxon, a global specialist in industrial NAND flash storage and hardware security solutions. Through this partnership, Farnell will provide customers greater access to Flexxon’s reliable industrial-grade storage solutions with uncompromising data confidentiality, integrity, and security. Flexxon specialises in high-performance storage solutions designed for demanding sectors such as healthcare,