News

Smith, a global distributor of electronic components and semiconductors, announced the appointment of Janos Boszormenyi to the role of Vice President, EMEA. In this role, Janos will help develop business opportunities and provide support to Smith’s five offices in the region. “Smith’s 40-year history and extensive global network provide a strong foundation to enhance and

Farnell has announced that LattePanda Mu compute module, carrier boards, and starter kit, the latest additions to the popular LattePanda range from DF Robot, are now available from stock. LattePanda Mu is a micro x86 compute module that features an Intel N100 quad-core processor with 3.4GHz turbo frequency. This combination provides solid performance and multitasking

Waldom Electronics announced TE Connectivity as the recipient of the Global Manufacturer Award at the inaugural Waldom ESG Awards. These first-of-their-kind awards within the IP&E (Interconnect, Passive, and Electromechanical) sector celebrate outstanding efforts in sustainability and responsible practices. The Global Manufacturer Award recognises TE Connectivity’s significant contributions to minimising waste and fostering a circular economy.

IC’Alps, designing ASIC, and ams OSRAM announced that they have entered in a foundry partnership agreement. The Preferred Foundry Partner network, powered by ams OSRAM, aims at facilitating access to semiconductor foundry services for ASIC design houses like IC’Alps in order to achieve fast and reliable market launch of customised ICs and early access to

XMOS has announced a strategic channel agreement with the global electronics distributor and supply chain expert, Astute Group. This partnership marks a significant milestone in the evolution of embedded solutions and further enables software engineers to create custom system-on-chip (SoC) solutions more efficiently. As an innovation-driven distributor, Astute offers a range of wireless connectivity solutions, sensors,

Waldom Electronics announced the appointment of Roger Raley as Vice President and General Manager, Americas. Roger brings over 20 years of experience in the electronics distribution and advanced materials industries. He has held leadership roles at Arrow Electronics and TTI, where he spearheaded strategic growth and business expansion initiatives. “We are thrilled to welcome Roger

Farnell has announced the addition of the new NI mioDAQ device to Emerson’s USB data acquisition (DAQ) product line. The NI mioDAQ is Emerson’s most powerful bus-powered USB DAQ device to date, designed to simplify setup and enhance performance for engineering teams. Built with engineers in mind, the NI mioDAQ combines modern mechanical design, USB