EnSilica has joined the Design Centre Alliance (DCA) of the Taiwan Semiconductor Manufacturing Company‘s (TSMC) Open Innovation Platform (OIP).
This partnership signals a strategic move for EnSilica, reinforcing its role in advancing the development of next-generation system-on-chip (SoC) designs.
The TSMC DCA programme is designed to support chip implementation services and system-level design solutions, helping to lower design barriers for customers utilising TSMC’s cutting-edge technology. By joining this programme, EnSilica will further enhance its ability to develop mixed signal devices for a wide range of applications, including industrial, automotive, communications, and edge artificial intelligence (AI) chips, all while leveraging TSMC’s most advanced process technologies.
TSMC’s Open Innovation Platform (OIP) is recognised as one of the most comprehensive design ecosystems in the semiconductor industry, encompassing all critical aspects of integrated circuit implementation. The platform aims to minimise design challenges and boost first-time silicon success rates by encouraging the rapid deployment of innovative technologies within the design community. By harnessing TSMC’s advanced process and 3DFabric technologies, semiconductor designers can achieve unprecedented performance and power efficiency in areas such as artificial intelligence (AI), high-performance computing (HPC), and mobile applications.
Ian Lankshear, Chief Executive Officer of EnSilica, expressed the significance of the partnership: “Joining the TSMC DCA programme marks a significant achievement for EnSilica. Our deep expertise in mixed signal and RF design, combined with TSMC’s advanced technology, positions us to deliver unparalleled solutions to our mutual customers.”
Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC, welcomed the partnership: “We are pleased to welcome EnSilica to the TSMC OIP Design Center Alliance, providing value-added service and solutions in enabling semiconductor design using TSMC’s advanced process technologies. TSMC is committed to collaborating with our OIP ecosystem partners, including EnSilica, to empower customers in achieving their design goals and quickly bringing their innovation to market.”
