Market Analysis

Silicon photonics industry is entering rapid growth period

The silicon photonics industry is entering a period of rapid growth and diversification, according to Yole Group's new report

The silicon photonics industry is entering a period of rapid growth and diversification, according to Yole Group’s new report. ‘Silicon Photonics 2025 – Focus on SOI, SiN, LNOI & InP Platforms’ shows that as AI continues to drive exponential demand for bandwidth, the sector is transitioning to higher data rates. 200G/channel links are expected to become mainstream in 2026/27 and paving the way for 800G and 1600G transceivers. These solutions deliver the speed and energy efficiency that hyperscale data centres and AI clusters require.

“The industrial ecosystem brings together vertically integrated leaders such as TeraHop (former InnoLight), Cisco, Broadcom, and Marvell, alongside innovative startups including Ayar Labs, Lightmatter, Celestial AI, and Nubis Communications,” said Martin Vallo, PhD, Senior Technology & Market Analyst, Photonics, Yole Group. “Foundries and fabs like TSMC, GlobalFoundries, Intel, and STM, play a pivotal role in scaling technology, while equipment suppliers such as Applied Materials and ficonTEC enable high-performance manufacturing. Together, they fuel a dynamic industry delivering solutions for data communications, LiDAR, and emerging quantum technologies.”

Global competition is intensifying. China is scaling domestic capabilities, with TeraHop, Hisense, Accezlink, amongst others, shipping millions of modules to power AI interconnects. Bolstered by government programs and academic collaboration, Chinese players are closing the gap with Western suppliers and positioning themselves as global challengers.

In addition to the silicon photonics market report, ‘Co-Packaged Optics for Data Centers 2025’ examines how packaging innovation is transforming next-generation connectivity. CPO technology integrates optical transceivers directly with switch ASICs or processors, enabling low-power, high-bandwidth links. While linear-drive pluggable modules remain competitive, CPO is expected to offer unmatched customisation and scalability, with large-scale adoption targeted for 2028-2030.

With AI reshaping data infrastructure, silicon photonics and co-packaged optics represent critical enablers of tomorrow’s data centre. Yole Group’s 2025 reports provide detailed market forecasts, technology roadmaps, and ecosystem insights needed to anticipate shifts, align strategies, and seize opportunities in this fast-moving domain.

Managing Editor
Paige Hookway is the Managing Editor of Procurement Pro, where she brings over a decade of industry experience to shaping insightful, engaging, and forward-thinking content for the global electronics community. After graduating from the University of Greenwich with a 2:1 in English Literature, Paige blended her love of storytelling with a deep curiosity for technology – carving out a career that champions both innovation and the people behind it. Across her 10+ years in the sector, Paige has developed a strong reputation for uncovering emerging trends, translating complex concepts into accessible insights, and spotlighting the voices shaping the future of engineering. She is particularly passionate about encouraging the next generation of engineers and elevating women in tech narratives that inspire, empower, and drive meaningful change. When she’s not immersed in the latest engineering developments, Paige can be found wrapped up in a blanket with a cup of tea and a good book.