Across the globe, a race is on to construct new advanced fabs (semiconductor fabrication plants), so where are these cutting-edge facilities being built exactly?
The fab landscape
Owing in large part to the current tense nature of the geopolitical landscape, countries across the globe have been pushing increasingly to build more semiconductor fabrication facilities, especially within the West. In attempts to move away from Eastern manufacturing dependencies, both the US & EU have taken great steps to ensure that new fabs are being constructed on home soil. However, just like the West, the East isn’t just sitting idle and are themselves in a rush to create newer and greater fabs.
Geopolitical concerns surrounding China, new legislation from US & EU nations that support domestic projects (such as the US Chips Act), and the COVID-19 pandemic shortages remaining fresh in industry minds, are all key driving forces behind these developments.
Despite efforts from the US & EU, there is still no dispute that the crown of the most advanced fabs in the world remains in East Asia. With big companies like Samsung, TSMC, Micron Technology, and a long-standing history of producing the very best in the industry, it is no wonder that it’s hard to topple these semiconductor giants. Only three of the 21 new fabs in the US come anywhere close to the 10nm threshold that deems them as “leading-edge” chip manufacturing facilities. Meanwhile in Asia, across Japan, South Korea, and Taiwan, nine brand-new leading-edge facilities are in production. In the EU the situation presently stands that only one facility is in production, that being Intel’s Magdeburg fab in Germany. However, this fab, upon completion will take the title as the world’s largest and most advanced fab capable of 1.5nm chips.
To better understand the landscape, here is an outline of what facilities are being built and where:
Taiwan – 4 advanced fabs
Taiwan is joint top when it comes to building new advanced fabs with 4 projects in development, driven by the semiconductor powerhouse TSMC.
- Fab 20 – TSMC – This fab is being built in Baoshan, starting construction in 2022 with an expected completion date of 2025. The fab will be capable of producing 2nm nodes.
- Fab 22 – TSMC – This fab is being built in Kaosiung, starting construction in 2023 with an expected completion date of 2025. This fab is said to be capable of producing 2nm nodes.
- Taichung Fab – TSMC – As the name suggests, the fab is being built in Taichung, starting construction in 2024 with an estimated completion date of 2027. This fab has a goal of achieving the most cutting-edge nodes of just 1.4nm.
- New Tapai Fab – Nanya Technology – This fab is being built where its name suggests, New Tapai, with construction starting in 2022 and finishing in 2026. This fab will be capable of 10nm nodes.
Japan – 4 advanced fabs
Japan is the other top spot holder, with 4 of its own advanced fabs in the works by three different companies.
- Hiroshima Fab – Micron Technology – The Hiroshima Prefecture is where this fab will call home, starting construction in 2022 and beginning production by 2025. The fab will be able to produce 10nm nodes.
- Fab-23 (Phase 3) – TSMC – Fab 23 is somewhat of an anomaly in this list, being that whilst it is confirmed to be happening, details on it are scarce. It is proposed that the fab will be built in Kumamoto and will be capable of 2nm nodes, however, a start and finish date have yet to be confirmed.
- IIM-1 Fab – Rapidus Corporation – This advanced facility is being built in Hokkaido, beginning construction in 2023 with a completion date of 2027. This facility will have capabilities for 2nm nodes.
- IIM-2 Fab – Rapidus Corporation – Similarly to IIM-1, this fab is to be built in Hokkaido, construction starting in 2025 and finishing in 2027. This is to be Japan’s most advanced fab with 1nm node capabilities.
US – 3 advanced fabs
The US has 3 advanced fabs in the work, a key part of its project to become independent in its chip manufacturing ability, spurred on by Intel.
- Fab 52 & Fab 62 – Intel – These two fabs are key components of American chip manufacturing efforts. Both are being built on the same complex in Arizona, starting their construction in 2022 with completion expected within 2024. Both facilities will be able to produce 7nm nodes.
- Ohio Fab – Intel – Ohio is the name and building place of this advanced fab, with construction beginning in 2022 and finishing by 2026. This fab will be capable of 20nm node production.
- Fab 21 – TSMC – Whilst not a new advanced fab, TSMC’s Fab 21 deserves a mention as it is a facility undergoing expansions to facilitate advanced semiconductor manufacturing. Located in Arizona, the fab began expansion efforts in 2023 and is touted to be completed by 2026. Once finished it will become America’s most advanced facility on home soil capable of 3nm node production.
Germany – 1 advanced fab
Intel is leading Europe to its first advanced semiconductor facility located in Germany.
- Fab 29 – Intel – This advanced fab will be the only one in Europe, located in Magdeburg, Germany. This fab hasn’t begun construction quite yet but is expected to begin within the last quarter of 2024 or early 2025, with production beginning sometime in 2027. This advanced facility would become one of the most advanced in the world, capable of 1.5nm nodes.
South Korea – 1 advanced fab
South Korea is the final nation that is producing a new advanced fab, with chip giant Samsung at the wheel.
- Pyeongtaek Fab – Samsung – Located in Pyeongtaek, this facility began construction back in 2020 and was hoped to be completed in early 2024, however, delays to construction might see it pushed back to early 2025. This facility will be one of Samsung’s best, able to produce nodes up to 4nm.