MacDermid Alpha Electronics Solutions acquires Micromax
Element Solutions Inc, the parent company of MacDermid Alpha Electronics Solutions, has signed a definitive agreement to acquire Micromax, a global supplier of
News
News
$10.2M to supercharge microelectronics industry across Massachusetts
The Healey-Driscoll Administration and the Northeast Microelectronics Coalition (NEMC) Hub have awarded $10,174,823 to 10 microelectronics projects through its Supporting Chip Advancement from
Sourcing Strategies
Webinar on instant PCB pricing for North American EMS
Luminovo will host a webinar on Tuesday, 11th November at 3:00pm ET on instant PCB pricing and strategies for staying competitive in the
Market Analysis
Power GaN market set for rapid sixfold expansion
Yole Group announces the release of its new edition of the Power GaN report, Power GaN 2025. This provides an in-depth analysis of
News
New President and new Vice-President of EPCIA elected
On 21st October 2025, at the last formal meeting of the European Passive Components Industry Association (EPCIA) in Dillenburg, Germany, both Christophe Pottier,
Sustainability
Integrating Life Cycle Analysis into PCB design
Electronics are everywhere. From consumer devices to industrial equipment, printed circuit boards (PCBs) form the core of modern technology. As demand for electronics
News
Mouser now stocking Silicon Labs’ Explorer Kit
Mouser Electronics is now shipping the new Wireless xG28 Explorer Kit for Amazon Sidewalk from Silicon Labs. The xG28 Wireless Explorer Kit offers
Market Analysis
Passive RFID market 2025: growth dynamics explained
The RFID industry is expected to maintain its upward trajectory, with IDTechEx forecasting the passive RFID market to reach a total value of
Market Analysis
Global firms face $1.2Tn cost surge amid US tariffs
Global companies are expected to incur at least $1.2 trillion (£895bn; €1tn) in additional expenses during 2025, largely due to renewed US tariffs
Market Analysis
New growth engines for glass in advanced packaging
As semiconductor chip architectures become more complex and performance-driven, the materials enabling advanced packaging are evolving just as fast. Yole Group’s new report,