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Molex completes AirBorn acquisition

Molex has completed its acquisition of AirBorn, a global manufacturer of rugged and highly reliable connectors and electronic components designed for mission-critical applications across aerospace and defence, commercial air, space exploration, medical, and industrial markets. AirBorn brings an expansive product portfolio and proven aerospace and defense solutions to Molex, which is known for its deep

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SEMI publishes recommendations for semiconductor policies

SEMI has published recommendations for the European Union to bolster its semiconductor ecosystem. The SEMI Europe Recommendations for the 2024-2029 Legislative Term paper urges the new Commissioners assuming office to implement legislation to advance the semiconductor sector given its role as a key driver of technological advancement, economic growth, and ensuring Europe’s future competitiveness on

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Tria Technologies partners with Qt Group

Tria, an Avnet brand for embedded compute boards, has joined forces with Qt Group, a global software company based in Finland, on the development of new solutions to help OEMs build advanced human machine interface (HMI)/graphic user interface (GUI) designs. Tria’s HMI services include design and prototyping through full system assembly and product integration. This

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Farnell extends sensor portfolio with Roxspur

Farnell has announced the addition of Roxspur’s extended range of flowmeters, pressure transmitters, and thermocouples to its portfolio of sensor solutions from TT Electronics, a global provider of engineered electronics for performance-critical applications. Roxspur is a TT Electronics sensor brand, known primarily for providing complete temperature, pressure, flow, and instrumentation solutions for demanding applications across

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Watts sets up Trailing Edge to grow Flip in EMEA

Distribution industry veteran Nigel Watts has founded Trailing Edge Technologies to act as a Pan-EMEA Independent Sales Marketing and Operations (ISMO) business for Flip Electronics. “Trailing Edge is delighted to have been awarded a Pan-EMEA contract to represent Flip Electronics, an established and highly respected authorised added value distribution channel. It has partnered with some

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DigiKey’s 16th annual DigiWish holiday giveaway

DigiKey will launch its 16th annual DigiWish Giveaway on Dec. 1, 2024. DigiKey is kicking off the holiday season early by selecting 24 lucky winners as part of the company’s continued mission to help engineers, designers, and makers accelerate progress. To enter, participants must select one in-stock DigiKey product valued up to $100 and comment

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TTI Europe stocks OMRON’s high-power PCB relays

TTI IP&E – Europe is now stocking OMRON’s G9KC series of high-power PCB relays. The 480VAC, 40A relay’s 4-pole structure can replace larger multipole contactors and 3 or 4 single-pole relays for 3-phase (3-wire or 4-wire) power supply models, contributing to a smaller and lighter charging station design while saving labour costs and improving quality.

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US semiconductor investment boosts production

The US has taken another step in strengthening its standing in the semiconductor industry by finalising a $1.5 billion subsidy to GlobalFoundries (GF) to expand its chip production in New York and Vermont, aiming to create 10,000 jobs. This is part of the CHIPS and Science Act, a $52.7 billion programme designed to grow domestic

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Vizmonet goes global with DigiKey

Vizmonet has signed DigiKey as its global distributor. This strategic partnership aims to expand Vizmonet’s reach and enhance the availability of its cutting-edge products to customers worldwide. Vizmonet is a Singapore-based company founded in 2011 with a prime focus on the design and manufacture of carrier-class-customised wireless connectivity solutions. The company offers built-to-customise wireless solutions

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Intel claims $7.86bn CHIPS Act funding

The US Department of Commerce and Intel have reached agreement on terms to award the company up to $7.86 billion in direct funding for its commercial semiconductor manufacturing projects under the US CHIPS and Science Act. The award will support Intel’s previously announced plans to advance critical semiconductor manufacturing and advanced packaging projects at its

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