EnSilica joins TSMC Design Centre Alliance
EnSilica has joined the Design Centre Alliance (DCA) of the Taiwan Semiconductor Manufacturing Company‘s (TSMC) Open Innovation Platform (OIP). This partnership signals a strategic move for EnSilica, reinforcing its role in advancing the development of next-generation system-on-chip (SoC) designs. The TSMC DCA programme is designed to support chip implementation services and system-level design solutions, helping

