New 300mm wafer fabrication facility for power semiconductors
Toshiba is holding a ceremony to mark the completion of a new 300-millimetre wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation in Ishikawa Prefecture, Japan, one of Toshiba’s key group companies. The completion of construction represents a major milestone for Phase 1 of Toshiba’s multi-year investment programme. Toshiba

