In a recent report AI Vendor Race: Infineon Is the Company to Beat in AI Data Centre Power Semiconductors, Gartner examined the fast-evolving market for AI data centre power semiconductors and identified Infineon Technologies as “the company to beat” in this space.
The report cites Infineon’s ‘comprehensive product portfolio, manufacturing capabilities, and early investment in advanced technologies’ as the decisive factors behind its company-to-beat status. According to Gartner, Infineon’s front-runner position is being tested by growing competition in silicon carbide (SiC) and gallium nitride (GaN) and by rivals focused on the compute board level, dynamics that Infineon is actively addressing through its broad portfolio and system-level expertise.
As portfolio breadth and system-level expertise emerge as defining capabilities for AI data centre operators seeking to scale sustainably, Infineon projects €2.5 billion in AI market revenue for its fiscal year 2027, underpinned by the leading portfolio position across the AI power delivery chain.
A broad portfolio spanning the entire power delivery chain
Gartner recognises that Infineon secures its position in the AI data centre semiconductor market through a comprehensive ‘grid-to-core’ solution across the entire power delivery architecture, which strategically addresses the unprecedented power density and the thermal bottlenecks of high-performance AI workloads. While many competitors address only isolated stages of the data centre power chain, Infineon delivers optimised semiconductor solutions at every conversion stage, from solid-state transformers (SST), power supply units (PSU), and energy storage systems (ESS) to intermediate bus conversion (IBC) and processor-level power management, ensuring that efficiency, reliability, and performance are maximised across the entire system.
By optimising every link in the power delivery chain with the right semiconductor technology at each stage, Infineon enables data centre operators to reduce cumulative energy losses across multiple conversion stages, a critical advantage at hyperscale and a meaningful contribution to the industry’s broader sustainability goals.
SiC and GaN: the right technology at every stage
Reinforcing Infineon’s broad portfolio is its strategic combination of semiconductor materials. Gartner notes that Infineon’s strategic and early investments in wide-bandgap (WBG) semiconductors, including SiC and GaN, give it critical advantages in offering energy-efficient power solutions, particularly for next-generation 800VDC AI data centres. By seamlessly integrating advanced WBG materials – specifically SiC for high-efficiency, high-voltage grid-to-rack conversions, and GaN for ultradense, high-frequency intermediate power stages – alongside traditional silicon (Si) at the processor level, Infineon minimises energy loss at every single conversion step.
From powering AI data centres to Physical AI
Infineon continues to expand its partnerships across the AI value chain, working closely with system integrators, data centre operators, and technology leaders to accelerate the development of next-generation power architectures.
Beyond the data centre, Infineon’s advanced semiconductor solutions bring Physical AI to life, enabling humanoid robots, collaborative machines, and autonomous systems to perceive, think, and act safely and securely. With expertise spanning microcontrollers, power systems, sensing, connectivity, functional safety and security, Infineon is a trusted partner across the full spectrum of Physical AI platforms. With the global robotics market projected to reach up to $1.7 trillion by 2050 and 300 million humanoids operating worldwide (UBS Research, 2025), and an estimated average semiconductor bill of materials of $500 per humanoid robot, Physical AI represents one of the most significant growth opportunities of the coming decades. From the utility grid to the processor core, and from the data centre to the factory floor, Infineon powers the full arc of the AI era.
