Procurement Pro

Events Videos

EDS Leadership Summit interview with ECIA & TrustedParts

Managing Editor of Procurement Pro, Paige Hookway, interviews Victor Meijers, Senior Vice President, ECIA & TrustedParts at EDS Leadership Summit. Why authorised channels matter TrustedParts aggregates inventory exclusively from authorised distributors: “When you have the potential to put counterfeit parts or parts that have been mishandled into the supply chain, you really risk a lot

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Events Videos

EDS Leadership Summit interview with Future

Managing Editor of Procurement Pro, Paige Hookway, interviews Georgia Genovezos, Corporate Vice President, Digital Marketing at Future at EDS Leadership Summit. Genovezos oversees the company’s global digital presence, covering everything from website inventory and orders to creative content, social media, digital marketing, aggregator programmes, and co-op marcom campaigns. When asked about the current state of

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Events Videos

EDS Leadership Summit interview with Harwin

Managing Editor of Procurement Pro, Paige Hookway, interviews Peter Schneid, VP of Marketing at Harwin, about their latest report at the EDS Leadership Summit. Building on last year’s North American survey, Harwin has now expanded its research to include Europe, and the results reveal some striking regional differences, alongside broader shifts in how engineers are

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Events Videos

EDS Leadership Summit interview with TME

Managing Editor of Procurement Pro, Paige Hookway, interviews Mark Burr-Lonnon, CEO Americas at TME, at the EDS Leadership Summit. Mark Burr-Lonnon brings decades of senior leadership experience across some of the most recognised names in electronics component distribution. In this conversation, he discusses his decision to join TME, the company’s growth ambitions, and what trends

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News

Texas Instruments set to acquire Silicon Labs

Texas Instruments (TI) has agreed to acquire Silicon Labs in a move to expand its presence in embedded wireless connectivity. The $7.5 billion all-cash transaction has been approved by the boards of both companies. The acquisition will combine Silicon Labs’ portfolio of approximately 1,200 products, alongside its expertise in mixed-signal and embedded wireless technologies, with

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News

The AI packaging system for smarter workflows

It’s a tale as old as boxes. You order a part. The part arrives in a box big enough to house a small family, and your order sits, lonely, rattling around somewhere in its depths. It is, quite literally, a waste of space. Could a proof of concept using NVIDIA’s Jetson Nano Orin compute execute

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Supply Chain Management

Sustainable procurement in consumer electronics – Pt 3

P3: Reducing waste, EoL, and conclusion In April 2025, a national survey commissioned by UNA Watch found that people would rather replace their technology than repair it. And, to be honest, repairability is not always easy, quick, or cheap. In this regard, I think it is fair to say that consumer electronics are one of the

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News

DRAM and NAND price rises tied to AI data centre demand

Electronics procurement teams are facing renewed supply chain volatility as memory and storage prices climb in 2026. This is driven by sustained demand from AI data centres. Since October 2025, contract pricing for both dynamic random-access memory (DRAM) and NAND flash has risen sharply, with some areas seeing double-digit percentage increases in successive quarters. This

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News

Growing optoelectronics demand and the procurement challenge

In 2024, the global optoelectronic market was valued at $156.65 billion. That figure is expected to grow to $213.32 billion by 2032. This growth reflects expanding adoption across multiple sectors, but it also brings new pressures for procurement teams, which must manage cost, risk, compliance, and supply continuity amid rapid technological change and increasingly complex,

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News

What is tape and reel process?

Tape and reel is a packaging and handling method used for electronic components, primarily surface-mount devices (SMDs), that prepares them for automated assembly. In this process, individual components are placed in shaped pockets on a continuous strip of carrier tape. A protective cover tape is sealed over the pockets, and the tape is wound onto

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